Vehicle power distribution box

ABSTRACT

A power distribution apparatus includes a conductive plate ( 100 ), the conductive plate ( 100 ) including plurality of contact pads ( 101 ) that are interconnected by removable connecting links ( 102 ), each of the contact pads ( 101 ) including opening ( 106 ) for receiving a connector pin, a housing ( 811 ), for the conductive plate, the housing including plurality of connector receptacles ( 820 ), and plurality of connector pins selectively mounted on a portion of the receiving opening ( 106 ) on the conductive plate so as to align with the connector receptacles ( 820 ), wherein a portion of the connecting links ( 102 ) are removed to create a circuit on the conductive plate ( 100 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of PCT Internationalapplication No. PCT/US95/10016, filed on Aug. 8, 1995, which designatedthe United States of America, and which is a continuation-in-part ofU.S. patent application, Ser. No. 08/287,623, which was filed on Aug. 8,1994.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to a distribution system for electricpower, and in particular to an electrical power distribution system fora vehicle.

2. Description of Related Art

The first motorized vehicles had little in the way of an electricalsystem. All that was required was some way to generate and distribute anignition potential to each of the cylinders of the small, internalcombustion engine that powered these early vehicles.

The need to see the road ahead during nighttime operation gave rise tothe first electrical accessory: headlights. Interior illumination wasadded for the operator's convenience, and a single tail light wasconsidered adequate. Turn signal lights followed, but the simple vehicleradio receiver did not make its appearance until a number of yearslater.

The modern automobile is an impressive collection of electricalhardware: from stereo sound equipment to air conditioning; from powerwindows, mirrors and seats to keyless entry systems; from vehicle alarmsto seat position memory to electrically heated seats. The complexity ofvehicle electrical systems has grown almost exponentially since theautomobile's introduction.

Automotive and truck electrical systems are a formidable combination ofhigh-current and low-current circuitry. In many cases, relays arerequired for control purposes, and all circuits must be adequately fusedto protect expensive components and to guard against the danger of fire.In order to facilitate the replacement of fuses and relays, and tosimplify interconnection of electrical hardware, many different electricpower distribution systems have been tried.

One approach that has been tried with fair consistency is to centralizefuse and relay mounting, then route input and output connections fromthis central location. The first systems built using this approachincluded a great deal of point-to-point wiring. Hand wiring is verycostly, and manual wiring operations are a source of wiring errors thatnegatively impact product quality. In addition, massive wiring bundlescreate a hazard of shorts or fire.

Another approach has been the construction of customized distributionnetworks stamped as strips from thin metal sheets—“stamp tracks.” Thesestamp tracks are formed metal sheets that have contact tabs protrudingthrough openings in custom designed plastic shells. Although thisapproach yields a higher quality product, tooling costs are very high,since virtually every automobile model requires a unique distributionsystem. At least some of this uniqueness aspect is driven by theproliferation of fuse and relay packages. A distribution product must beable to accommodate the fuse and relay components selected by themanufacturer.

Yet another approach has centered around the use of flexible circuitboard technology, or “flex circuits.” Flex circuits are constructed bydepositing conductive material between two flexible insulating layers.Although the unique distribution requirements of each vehicle modelwould require unique flex circuits for each application, tooling costsare much lower than the metal stamping/custom plastic housing approachdescribed previously. The principal disadvantage of the flex circuitapproach is that the conductive layers are very thin, and the highcurrent densities required in vehicle power distribution lead tooverheating and eventual failure.

Consequently, a need arises for a vehicle electric power distributionsystem that can be customized for a particular vehicle with relativeease, that avoids high tooling costs for custom designed components,that is reliable in a high current environment, that will accommodate awide range of fuse and relay packages, and that is relativelyinexpensive to manufacture.

OBJECTS AND SUMMARY

These needs and others are satisfied by the electrical circuit platesand electric power distribution apparatus of the present invention. Theapparatus includes a plurality of conductive circuit plates stacked toprovide an electrical distribution system. Each plate has an arrangementof contact pads, wherein at least some of the contact pads areelectrically connected to selected other contact pads of the sameconductive plate via integrally formed conductive traces. The apparatusfurther includes a plurality of conductive pins providing electricalcontact between selected contact pads of different selected conductiveplates.

The present invention further relates to a power distribution apparatuscomprising a conductive plate, the conductive plate including aplurality of contact pads that are interconnected by removableconnecting links, each of the contact pads including means for receivinga connector pin, a housing for the conductive plate, the housingincluding a plurality of connector receptacles, and a plurality ofconnector pins selectively mounted to a portion of the receiving meanson the conductive plate so as to align with the connector receptacles,wherein a portion of the connecting links are removed to create acircuit on the conductive plate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1(a) is an enlarged top plan view of a stamped conductive plate ofthe present invention;

FIG. 1(b) is a partial enlarged plan view taken along line 1 b of FIG.1(a);

FIG. 2(a) is a top plan view of another embodiment of the presentinvention;

FIG. 2(b) is a cross-section view taken along lines 2(b)—2(b) of FIG.2(a);

FIG. 2(c) is a bottom plan view of the conductive circuit plate of FIG.2(a);

FIG. 2(d) is a side elevational view of another embodiment of thepresent invention;

FIG. 2(e) is an enlarged view of the layout of the three conductivecircuit plates used in FIG. 2(d);

FIG. 2(f) illustrates yet another layout of the three conductive circuitplates used in FIG. 2(d);

FIG. 3(a) is a side section view of vertically stacked conductivecircuit plates in a housing;

FIG. 3(b) is a stylized sectional depiction of conductive pinspenetrating the conductive circuit plates;

FIGS. 4(a)-(c) are top, side, and rear views, respectively, of a pinterminal suitable for use with the present invention;

FIGS. 5(a)-(c) are top, side, and front views of a terminal springsuitable for use with the pin terminal of FIG. 4;

FIG. 6 is a stylized section view of an electric power distributionapparatus showing interconnection with a circuit board;

FIG. 7(a) is an enlarged plan view of an alternative embodiment of aconductive plate in accordance with the present invention, with aportion of an insulating layer cut away;

FIG. 7(b) is a partial enlarged plan view taken along line 7 b of FIG.7(a);

FIG. 8 is a top plan view of a conductive plate in accordance with thepresent invention;

FIG. 9 is a bottom plan view of the conductive plate of FIG. 8;

FIG. 10 is a side section view illustrating the conductive plates of thealternative embodiment in a vertically stacked configuration;

FIG. 11 is a top plan view of another feature of the present inventiondepicting the conductive plates in a stacked side-by-side configurationwith conductive extender portions and conductive bridges;

FIG. 12 is a top plan view of the top layer of the stacked configurationof FIG. 11;

FIG. 13 is a top plan view of the middle layer of the stackedconfiguration of FIG. 11;

FIG. 14 is a top plan view of the bottom layer of the stackedconfiguration of FIG. 11;

FIG. 15 is a side elevational view of the stacked configuration of FIG.11

FIG. 16 is a side section view of a vertically stacked arrangement ofconductive plates in combination with a printed circuit board;

FIG. 17 is a bottom plan view of the embodiment of FIG. 16 illustratingthe placement of electronic components on the circuit board;

FIG. 18 is a schematic diagram of the circuitry illustrated in FIG. 17;

FIG. 19 is a perspective view of an alternative embodiment of thepresent invention;

FIG. 20 is a cross section taken along line 20 of FIG. 19;

FIG. 21 is a cross section taken along line 21 of FIG. 19;

FIG. 22 is a plan view of a conductive plate used in the embodiment ofFIG. 19;

FIG. 23 is a plan view of an insulating plate used in the embodiment ofFIG. 19;

FIG. 24 is a cross section of the plates of FIGS. 22 and 23 usedtogether, taken along line 24 of FIG. 22;

FIG. 25 is a cross section of the plates of FIGS. 22 and 23 usedtogether, taken along line 25 of FIG. 22; and

FIG. 26 illustrates a specific circuit using the embodiment of FIG. 19.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

We have developed a reliable, low-cost electric power distributionsystem which finds particular use in a vehicle. However, the inventiondescribed is not limited to vehicle applications and can be used for anyoperation which requires a power distribution panel capable ofsupporting a wide range electrical wiring architecture. We provide aconductive circuit plate that has a repeating pattern of openings andshaped cut-outs. The shaped cut-outs are arranged so that the materialleft surrounding the openings define electrical circuit paths extendingfrom and interconnecting each opening. The desired circuit path iscreated by selectively electrically isolating openings and theirsurrounding material from other openings-and their surrounding material.Multiple circuit plates may be stacked to provide a desired distributionpanel. An interconnection between the stacked circuit plates may beaccomplished by using connective pins positioned in the openings tointerconnect the circuits defined on successive circuit plates. Theplacement of the openings is such that they accommodate standard circuitelements i.e., fuses, relays, etc., which may be installed in the formedcircuit paths. With the addition of these active circuit elements, acomplete panel is capable of serving as the central processor for theentire vehicle. The invention can best be understood with reference tothe accompanying drawing figures.

FIGS. 1(a) and 1(b) are top plan views of one example of a conductivecircuit plate prepared according to the invention, and generallydepicted by the numeral 100. Preferably, the conductive circuit plate isfabricated by stamping from a conductive metal sheet having a thicknessof from about 0.5 to about 1.3 mm. Many different conductive materialsof varied thicknesses would be acceptable, depending upon the intendeduse of the circuit plates. For vehicle uses, the preferred metal iscopper. The conductive plate shown is stamped from 0.08 mm CDA 110 halfhard copper. In a preferred embodiment, to facilitate subsequentsoldering operations, the conductive circuit plate 100 is solder platedor coated to provide a solder layer thickness of about 0.005 to about0.01 mm. The conductive material may be preplated or coated before thestamping operation, or a plating or coating may be added later. One ofthe preferred solder compositions for a copper base is a tin soldercomposition. Of course, other suitable compositions, known to thoseskilled in the applicable art, may be substituted for the solder justdescribed.

A feature of the conductive circuit plate (100) is a plurality ofinterconnected first contact pads (101). The first contact pads (101)are formed by stamping a plurality of cut-outs (101 c) between verticalcenter lines (101 a) and horizontal center lines (101 b). The verticaland horizontal portions of each cut-out (101 c) are rectangularstampings. As shown, the cut-out (101 c) is a Greek type cross asdefined on page 309 of Webster's Ninth Collegiate Dictionary. Thecut-outs (101 c) are spaced in a predetermined pattern. In thisinstance, vertical center lines (101 e) through the vertical legs of thecrosses (101 c) are parallel with the contact pad center lines (101 a)and the horizontal cross center lines (101 d) are parallel with thehorizontal pad center lines (101 b).

The conductive plate 100 has, as an option, a plurality of secondcontact pads (107) and third contact pads (108). The contact pads (101)are preferably all identical, and the second contact pads (107) aregenerally adjacent one end of the conductive plate. The contact pads(107), as shown, are not identical, but if desired they may be. Thethird contact pads (108) are generally adjacent the other end of theconductive plate. The contact pads (101) are arranged to provide a rightangle grid pattern as shown in FIG. 1(b). That is, vertical groups ofcontact pads (101) have vertical center lines (101 a) extending parallelto each other, and the horizontal groups of contact pads have horizontalcenter lines (101 b) extending parallel to each other. The horizontalcenter lines (101 b) intersect the vertical center lines (101 a) atright angles. The vertical center lines (101 a) are each equally spacedapart from each other, and preferably spaced apart to accommodate aminifuse, such as an ATM-style minifuse manufactured by the BussmannDivision of Cooper Industries.

The horizontal center lines (101 b) are also each equally spaced apartfrom each other and preferably spaced apart to accommodate a minifuse asdescribed above. Thus, both the vertical and horizontal contact padcenter lines are spaced apart substantially the same distance. In thepreferred embodiment, the contact pad center lines are spaced apart adistance of about 7.9 to about 8.1 mm.

Of course, the rectangular array arrangement of contact pads need not bestrictly adhered to. It may be discovered that a triangular, hexagonal,circular, elliptical, or other combination of these arrangements ofcontact pads best serves a particular application. With a triangular orhexagonal array of contact pads, for example, the coordinate systemformed by the contact pad center lines would no longer be rectangular innature, but would form, in one instance, concentric triangles orhexagons. Centerline spacings would still be arranged to conform to thecontact spacing of industry standard components.

For any array of contact pads, center-to-center spacing would be such toaccommodate components with standard lead spacing (or an integralmultiple of a standard spacing) in more than one direction, thusproviding a great deal of component orientation flexibility.

The first contact pads (101) are shown as having a substantially squareshape. However, the shape of the contact pads is best determined by theultimate use of the circuit plates. Use may dictate that the contactpads be nonrectangular, triangular, circular, elliptical, or any desiredshape as shown hereinafter. Generally, the circuit plate (100) has atleast 9 first contact pads (101). Although the first contact pads (101)are depicted in the figure as having holes (106) of a uniform sizetherethrough, the contact pads could also be fabricated withoutopenings, or with openings of varying dimensions. The second and thirdcontact pads (107, 108) have irregular shapes that are used to holdvarious other components such as relays and other size fuses.

The contact pads (101, 107, 108) are shown electrically connected toselected other contact pads by integrally formed conductive traces(102). In the preferred embodiment, there are at least three conductivetraces (102) for each pad (101). These conductive traces (102) areformed by the stamping die used for conductive circuit platefabrication, although other methods of forming these traces are notprecluded, and will occur to those of skill in this fabrication art.Both the conductive circuit plate and the conductive traces could befabricated by using an etching process, for example. In application,some of these conductive traces (102) are removed by a subsequentoperation to ensure that electrical connection is made only betweenselected ones of the contact pads (101, 107, 108), as discussed ingreater detail hereinafter.

The conductive circuit plate (100) also includes a plurality of firstconnector electrical contacts (103) at one end of the circuit plate, anda plurality of second electrical contacts (104) at the other end of thecircuit plate. The electrical contacts (103, 104) are integrally formedduring fabrication, and are coplanar with and extend outwardly from theconductive circuit plate main body section. FIG. 1 shows these contacts(103, 104) as joined at a point distal from the main body of theconductive circuit plate by bars of material (105, 109). The contactsare formed in this way during the fabrication process to keep thecontacts from being bent or otherwise damaged. The bars of material(105, 109) can be removed by a cutting operation at a later stage ofmanufacture. In the alternative, of course, the bars of material (105,109) need not be used at all.

Another feature is that openings or holes (110) in the second and thirdcontact pads (107, 108) are not centered on these pads and are locatedto facilitate electrical connection to the conductive circuit plate indifferent arrangements than rectangular array of contact pads describedabove. The mounting holes (110) are provided with varied spacings toaccommodate electrical connection to electrical components of differentsizes, and different mounting or socketing arrangements.

FIGS. 2(a)-2(c) illustrate yet other features of the present invention.These depict an insulated conductive circuit plate having a conductivecircuit plate (100 a) without the bars (105, 109), and at leastpartially coated or attached thereto with a nonelectrical conductivematerial (201). In the preferred embodiment, this is an electricallyinsulating material such as Rynite FR530, 94V-0, manufactured by E.I.DuPont Company and described as a PET (polyethylene terephthalates)thermoplastic polyester, but any of a number of insulating plastic orother materials would serve in this application, as is well-known in theart. Preferably, the spacing or insulating material can be applied usingan injection molding process, wherein the conductive circuit plate (100,100A) is supported by pins or other supporting structure within themold, and mold inserts determine the areas where the insulating material(201) is prevented from flowing. As a general statement, it can be saidthat the conductive circuit plate (100 a) is at least partially coveredor coated by the insulating material, with the exception of areas (202)near the central portions of the contact pads (101) and which surroundsthe openings (106, 110), areas (203) over the conductive traces (102)that interconnect selected contact pads (101), and areas (204) as noted.These areas are kept clear of the insulating material so that the traces(102) may be easily removed and portions of the contacts removed. Alsoshown in FIG. 2(a) are the electrical contacts (103, 104), now freedfrom the restraining bars of material (105, 109) illustrated in FIG. 1.It should be noted that the material from which the conductive circuitplate is fabricated permits a rotation or bending of the electricalcontacts (103, 104), so that the plane of one or more of the electricalcontacts (103) may be made perpendicular to the plane of the conductivelayer itself. Although not shown in the figure, this ability to changethe plane in which one or more of the electrical contacts is orientedadds greater flexibility in terms of interconnection with external powerdistribution networks, which may include electrical connectors andattached electrical wires.

FIG. 2(b) illustrates the relative thickness of the insulating material(201). As shown in the figure, the insulating material (201) extendsoutward from one surface of the conductive circuit plate only, althoughthis application technique need not be strictly adhered to for properassembly. The distance the material extends is determined by the desiredspacing between two adjacent plates 104. FIG. 2(b) shows the vacatedareas of the circuit plate, some of which are described above, whereinsulating material is not permitted to flow.

FIG. 2(c) is a bottom plan view of the coated conductive circuit plateshowing the circuit plate (100 a) after the electrically insulatingmaterial (201) has been applied. As noted above, in this embodiment, theelectrical insulating material is applied principally to only one sideof the conductive circuit plate (100 a). However, as has also beennoted, this design practice need not be strictly adhered to for theinvention to function properly.

FIG. 2(d) shows a side schematic of three insulated conductive circuitplates stacked vertically, one on top of another, with electricalcontacts (103, 104) extending outwardly therefrom. In this embodiment,the middle or second insulated circuit plate has had the contacts (103,104) removed prior to being assembled, and the bottom or third circuitplate has had one set of contacts (104) removed. Depending upon theultimate use, selected contacts from the groups (103, 104) of conductorson each circuit plate may be removed.

The insulating material that adheres to each of the conductive circuitplates prevents unwanted electrical contact between different conductivecircuit plates. The insulating material also serves another purpose. Theinsulating layers also provide equal spacing for the conductive plates,and help maintain the conductive plates in a substantially parallelrelationship.

As mentioned above, with reference to FIG. 2(a), the insulating materialis preferably kept away form certain areas, namely, the areas around thecentral porions of the contact pads, and the areas around the integrallyformed conductive traces. This is because a subsequent operation servesto selectively remove the integrally formed conductive traces betweenselected contact pads where electrical contact is not desired. Ofcourse, the conductive traces need not be removed completely, but maysimply be severed on one end and bent out of the plane of the circuitplate to avoid electrical contact. Coating or encapsulating theconductive circuit plate in the manner described acts to hold theconductive circuit plate together, even if it should become necessary tocompletely sever the electrical and physical connections betweenselected portions of the layer and the main body of the layer. Althoughit is not shown in the figure, the stamping operation that is used toform the conductive circuit plate can be constructed in such a way thatit “kicks” portions of the conductive layer, such as the corners of thecontact pads, out of the plane of the remainder of the conductive layer,so that these “kicked out” portions may be embedded more securely in theinsulating material, thus forming a stronger structure. Further, as willbe discussed in more detail below, the openings previously described inthe contact pads may require enlarging to conform to the inventiveassembly process, and will also require soldering to ensure goodelectrical contact with selected other conductive layers. This isspecifically why the central portions of the contact pads are left freeof insulating material.

FIG. 2(e) illustrates how a conductive path is formed within theapparatus. Three different conductive circuit plates (204, 206) areshown in the figure. One of the significant economies of the inventiveapparatus is the fact that the conductive circuit plates aresubstantially identical prior to the shearing operation that removes ordisconnects selected conductive traces. A single stamping tool is usedto fabricate the conductive circuit plates, and a single mold-in-placeoperation coats or encapsulates the conductive circuit plates. It is notuntil the shearing operation that removes or disconnects selectedconductive traces and/or enlarges selected contact pad openings, thateach conductive circuit plate begins to assume a unique identity.

The conductive circuit plates (204, 206) of FIG. 2(e) would be, in thepreferred embodiment, first coated with a solder composition and thencoated or encapsulated with insulating material prior to the shearingoperation that defines specific conductive paths, but, for the sake ofclarity, the solder coating and insulating material is not shown. Powermay be applied to an upper conductive circuit plate (206) through anelectrical contact (104). Note that conductive traces that originallyconnected adjacent contact pads around the periphery of the shaded area(207) of the upper conductive circuit plate (206) have been removed by ashearing operation, so that the shaded area (207) is electricallyisolated from the surrounding region. The conductive path leads to afirst contact pad (208), to which an electrical connector (not shown)would ordinarily be affixed to accommodate one terminal of a fuse, asindicated. A second adjacent contact pad (209) has also beenelectrically isolated from the remainder of the shaded region (207), sothat another electrical connector may be provided to contact theremaining terminal of the fuse. Of course, electrical connectors aregenerally provided as a part of a conductive pin penetrating theconductive layers. For the sake of clarity, only one of the conductivepins (210) is shown, and much of its length is indicated in dashedlines, since the length has been exaggerated to present a clear view ofthe conductive circuit plates (204, 206). The conductive path extendsthrough the first contact pad (207), through the fuse, to the secondcontact pad (209).

At this point, the conductive pin (210) makes electrical contact withthe contact pad (209), and extends the conductive path in the directionof a second conductive circuit plate (205). For this particularconductive path, the second conductive circuit plate (205) is notinvolved, so the opening in the contact pad (211) through which theconductive pin (210) traverses has been enlarged so that the pin (210)does not make electrical contact at this point. Note also that thesecond conductive circuit plate (205) has had both sets of electricalcontacts (103, 104) removed by a shearing operation, since thesecontacts are not needed in this example.

The conductive path continues via the conductive pin (210) to a bottomconductive circuit plate (204), where the pin makes electrical contactwith the contact pad (212) through which it passes. The shaded area(213) of the bottom conductive circuit plate (204) has been electricallyisolated from the surrounding portions by removal of the conductivetraces that originally connected adjacent contact pads around theperiphery of the shaded area (213). The conductive path continues to anelectrical contact (103) extending outwardly from the conductive circuitplate, through which power may now be distributed via an externaldistribution network that connects to the electrical contact (103) via amating connector and cable assembly (not shown).

FIG. 2(f) is an alternative representation of a conductive circuitlayout. Power is applied to an electrical contact (104) on an uppercircuit plate (206), where it is distributed to a middle plate (205) bythe conductive pin arrangement described above (all pins not shown, forthe sake of clarity). From a contact pad on the middle plate (205),power is distributed over the contact pads shown in the shaded area(220), where power is fed back to the top layer (206) through a set ofcontact pads (226 and 221) connected by a conductive pin (not shown). Afuse or other suitably spaced component can then be placed betweencontact pads (221 and 227), using the electrical terminals in which thepins terminate, as described above, with output power proceeding to oneof the electrical contacts (223) at the edge of the top circuit plate(206). Power is also fed through to the top circuit plate from contact(229) to contact (222), where it is applied to a relay package (224)which is shown schematically. When a control signal (electrical ground)is applied to the appropriate relay contact through the input electricalconnector (225), the relay energizes, and the output voltage appears atthe appropriate output contact (228) on the top plate (206).

Whenever the electrical path changes from one circuit plate to another,it must do so through a conductive pin. Even though all of theconductive pins in FIG. 2f are not shown, for the sake of clarity, aconductive pin must make electrical contact with pads (222 and 229) inorder to complete the desired circuit path. Similarly, a conductive pinmust penetrate pads (221 and 226) in order to bring the power inputcircuit back to the top plate (206). Of course, conductive pinsordinarily penetrate all of the circuit layers, and openings in thecontact pads through which the conductive pins penetrate must beenlarged to avoid pin contact where no contact is desired, even thoughthis is not shown in FIG. 2f in every instance where such openingenlargement is desirable.

The assembly views of FIGS. 3(a) and (b) further serve to illustrate acomplete assembly of conductive circuit plates. In FIG. 3(a), fourconductive circuit plates (301-304), complete with associated insulatingmaterial (307, for example), are stacked vertically, with a plurality ofconductive pins or connectors (310) providing electrical contact betweenselected contact pads of different selected conductive circuit plates.Some of the openings (such as 309) previously described in the centralportions of the contact pads are made substantially larger than theoutside diameter of the conductive pins (310), so that no electricalcontact will be made with the associated pin. Other openings (308) areactually extruded slightly, as shown, so that the pin is an interferencefit in the opening, and good mechanical contact, as well as electricalcontact, can be made between contact pad and pin. After the pins areinserted through the openings in the contact pads, they may be solderedto each pad with which they come into contact.

Selected conductive pins can be provided with electrical connectors onat least one end. In FIG. 3(a), each of the pins (310) is shown with anelectrical connector (311) at one end. The electrical connector (311)shown in this view is integrally formed as a part of the pin, but theconnector could be formed in alternative ways (to be discussed below).Various electrical components (312), fuses in this illustration, areshown mounted so that the components (312) make electrical contact withthe electrical connectors (311). It should be noted that the inventivedistribution apparatus is designed to accommodate various electricalcomponents used in vehicle electric power distribution systems,including, but not limited to: maxi-fuses or circuit breakers,mini-relays, micro-relays, and minifuses or circuit breakers. All ofthese component types are well-known in the automotive arts. Inaddition, since various component spacings are accommodated by thearrangement of contact pads on the conductive circuit plates, andbecause various designs of pins and associated electrical connectors arecontemplated by the invention, virtually any automotive electricalcomponent that might be a useful part of such an electric powerdistribution system, whether extant or yet to be developed, can beaccommodated.

FIG. 3(a) also shows a housing, in this view composed of a bottomportion (313) and a top portion (314), that substantially surrounds thevertically stacked conductive circuit plates. The housing shown ismanufactured of thermoplastic polyester, 30% glass filled. Of course,other housing geometries and materials are possible. The housing (313,314) includes an opening (315) designed to accommodate connection withan external electrical power distribution network. In this case, theopening (315) is designed to accommodate a connector housing (not shown)containing electrical connectors designed to mate with electricalcontacts (305, 306) integrally formed with the conductive circuitplates. The connector housing may include a wiring harness for routingof input or output power.

FIG. 3(b) is a somewhat stylized representation of conductive pins in analternative arrangement. Each pin (320) has a terminal spring or cap(321) that is separately manufactured, and is attached to the elongatedpin portion (320) by mechanical means (such as a snap-fit), or bybrazing, soldering, or similar well-known technique.

FIGS. 4 and 5 show the details of the multiple-piece conductive pindesign.

FIG. 4(a) is a top view of the pin terminal (401), in which details ofits construction can be seen. The tubular lower portion (403) of the pinterminal is formed by a stamping operation that causes the material ofthe lower portion to be rolled into a nearly circular cross section,thus leaving a longitudinal slot (402) extending throughout the entirelength of the lower body (403) of the pin (401). The extreme lowerportion is also slightly rounded by the forming operation, leaving ahole in the pin, at the bottom, that is slightly smaller than the insidediameter of the rolled structure. FIGS. 4(b) and (c) are side and rearelevational views, respectively, showing the geometry of the upperportion (404) of the pin (401). Preferably, the pin terminal (401) isfabricated from 0.7 ±0.07 mm CDA 110 half hard copper, with 0.005 to0.01 mm inch solder plate (which may be preplated stock). Of course, theforegoing discussion should not be interpreted to preclude the use ofother materials and geometries.

FIG. 5 shows details of construction of a terminal spring designed tooperate in conjunction with the pin terminal just described. Theterminal spring fits snugly on the pin terminal to provide a securemechanical and electrical connection. Preferably, the terminal spring(501) is constructed of stainless steel, so that the integrally formedspring member (503) will provide the requisite contact force to matingelectrical connectors. Because of the method of its fabrication, theterminal spring also includes a slot (502) extending longitudinally overits full length. FIG. 5(a) is a top view, while FIG. 5(b) is a sidesection view and FIG. 5(c) is a front view of the terminal spring.

Yet another inventive feature is illustrated in FIG. 6, a somewhatstylized depiction of the electric power distribution apparatus. Thedistribution apparatus illustrated shows five conductive circuit plates(601) separated by layers of insulating material (602), with conductivepins (603) providing electrical contact between selected contact pads ofdifferent selected conductive circuit plates. This embodimentillustrates that some of the conductive pins (603) terminate beforepenetrating all conductive layers, in contrast to what has been shownand described with reference to the other pertinent drawing figures.Also attached to the conductive pins is a printed circuit board (604) ofconventional design. The printed circuit board (604), in addition tosupporting electronic components (605), such as integrated circuits,resistors, capacitors, etc., may also include one or more connectors(606) for providing power or other electronic signal input and output.Thus, the electric power distribution described herein can easily beinterfaced with a range of electronic components, and the entireassembly can be placed in a housing, creating a rugged electronic modulefor vehicle installation that can support data logging, digitalelectronic control features, etc.

In another embodiment of the invention, the overall form factor of theconductive circuit plate is slightly modified, and the shape of theconductive pads is altered. These features are illustrated in FIGS. 7(a)and (b).

FIG. 7(a) is a top view of a conductive circuit plate, generallydepicted by the numeral (700). The circuit plate (700) is coated orplated with a thin solder coating. One surface of the solder coatedplate (700) has molded or coated thereon preferably an electricallyinsulating layer (701). Insulating layer (701) at least partially coversthe surface of the conductive circuit plate (700), in much the samemanner as described above with reference to the conductive circuit plate(100) and insulation (201). For the sake of clarity, the electricallyinsulating material (701) has been cut away in this view, to revealdetails of conductive circuit plate fabrication. It should be noted thatthe specific electrical insulation properties of this insulatingmaterial are not critical, since the insulating material is presentprimarily to provide an interlock for vertical stacking, which will bedescribed in detail below, and to provide spacing of contacts foralignment with external connectors. Of course, the insulating materialdoes space apart the circuit layers as well, as described above.

The conductive plate is still a generally rectangular grid arrangementof vertical center lines (702 a) and horizontal center lines (702 b).The contact pads (702) have openings or extrusions (703) through thecenter of the contact pads (702). However, the contact pads (702) do nothave the distinctly square form factor identifiable in the previouslydescribed embodiment. The contact pads (702) are formed by stamping aplurality of cut-outs (705) wherein the vertical and horizontal legshave flared ends. These provide the contact pads (702) with a pluralityof narrow attachment or gripping tabs (704). The specific purpose of thenarrow gripping tabs (704) will be treated in detail below.

The cut-outs (705) have a shape generally described in Webster's NinthNew Collegiate Dictionary, page 309, as a formée cross whereas cut-outs(101 c) of FIG. 1(b) is described as a Greek cross. Of course, the crossof the present invention has also been described as being similar to afour leaf clover in that it has rounded edges rather than the pointededges of the formée cross. The cut-outs (705) are spaced in apredetermined pattern. In this instance, vertical center lines (702 e)through the vertical legs of the crosses (702) are parallel with thecontact pad center lines (702 a) and the horizontal cross center lines(702 d) are parallel with the horizontal pad center lines (702 b).

Integrally formed conductive traces (706) are shown in dotted lines onFIG. 7(a) for illustrative purposes on only some of the conductive pads(702). As shown, all of the conductive pads have interconnecting traces(706) which extend between the wide ends of each stamped cut out (705).As illustrated in FIG. 7(a), the conductive pads are generally squarewith the gripping tabs (704) extending from each corner. The conductivetraces (706) of this embodiment are noticeably wider than the conductivetraces (102) of FIG. 1. The conductive traces (706) have enhancedcurrent-carrying capability.

In a fashion similar to that described above, the conductive circuitplates (700) in accordance with the present invention are preferablyidentically formed from a single stamping die, and are provided with anelectrically insulating material in a single mold. This initialuniformity of the conductive layer (700) is a major factor in theoverall economy of the inventive approach to vehicle power distribution.

As noted with reference to the previously described embodiment, thestamping operation that forms the basic conductive layer can “kick out”the corners of the contact pads so that these corners can be embedded inthe encapsulating plastic, thus forming a stronger overall structure. Inthe embodiment of FIG. 7, the narrow tabs of material (704) may bekicked out in the stamping operation. These tabs of material (704)extend outwardly from the conductive circuit plate (700) a greaterdistance than the kicked out corners of the rectangular contact pads ofthe prior embodiment. The kicked out tabs provide a strong attachmentstructure for the insulating material that is molded on the one surface.

As was the case with the prior embodiment, the electrically insulatingmaterial (701) is deliberately kept away from certain areas of theconductive circuit plate (700) in order not to interfere with subsequentoperations. In particular, the insulating material is not allowed toform near the openings or extrusions (703) in the conductive pads, noraround the conductive traces (706). Since selected ones of the openingsor extrusions (703) may require enlargement to avoid contact withconductive pins (described in more detail below), and the shearing toolmust be able to make contact with the conductive traces (705) to beremoved, the insulating material is kept clear of these areas.

To form the desired interconnection among selected contact pads (702),selected conductive traces (706) are removed, i.e., are sheared,subsequent to the application of the electrically insulating material(701). One advantage of this lack of insulating material in theimmediate vicinity of the conductive traces (706) is that the conductivetraces that have been removed or sheared can be identified by visualinspection.

As a part of the removing or shearing operation, or, in the alternative,in another subsequent operation, openings or extrusions (703) in thecontact pads with which electrical contact is not desired are enlargedas openings (703 a, FIG. 10). Since the outer surfaces of the circuitplate (700) are solder coated, the inner surface (703 c) of theextrusion is solder coated. Thus, the extrusion (703) provides arelatively large surface area (703 c) to electrically contact the pins(401). Also, the soldering of the pins (401) to the extrusion (703) isrelatively accurate and quick, especially when both the pins (401) andthe extrusion surface (703 c) have solder coatings thereon. Theextrusion surface (703 c) provides a press fit for the pins (401) andholds them in place before and after the pins (401) are soldered to thecontact plate extrusions (703). The extrusion operation may be combinedwith the shearing and enlargement operations as well, or the extrusioncan be accomplished as part of a separate process.

Because of the solder coating of both the conductive plates and theconductive pins used to complete electrical connection between layers,the assembly can be adequately soldered simply by heating, such as in asolder reflow process. Consequently, a standard reflow oven can be usedto effect the soldering operation and/or the pins can be heated to causesolder reflow.

FIG. 7 also serves to illustrate the deployment of integrally formedextended electrical contacts (708) extending outwardly from theconductive circuit plate (700) and coplanar therewith. In thisembodiment, two adjacent sides have fully formed extended electricalcontacts (708) extending outwardly therefrom, while the remaining twoadjacent sides have truncated contacts (707) extending outwardly.Although the extended contacts (708) are integral with the circuit plate(700) they may be separate and connected to the circuit plate (700) viamechanical electrical connection such as a rivet, welding, or mechanicalinterference fit via a punch and die operation. Since these componentparts are solder coated prior to attachment, heating of the assemblymelts the solder internal to these connections, aiding in properelectrical attachment.

All the circuit plates could be formed with four sided truncatedcontacts (707). The contacts (708) could then be welded, brazed, rivetedor mechanically attached to those truncated contacts (707) as desiredand prior to assembling the circuit plates (700) for the desiredapplication. Thus, a number of different size connector or extendedcontacts can be used with the same stamped circuit plate. Theseconfigurations of the conductive circuit plate represent the basicbuilding blocks for expanded configurations to be described below.

FIG. 8 is a top plan view of the conductive circuit plate (700)illustrating a layer of molded electrically insulating material (701) onone surface of the circuit plate (700). It will be noted from this viewof the insulated circuit plate (700) that there are regions (802) in thelayer (701) immediately surrounding and exposing the openings (703) inthe contact pads that are not covered with the electrically insulatingmaterial. In addition, regions (803) in the layer (701) immediatelyabove and exposing the conductive traces interconnecting selectedcontact pads are also preferably not covered with the electricallyinsulating material. A raised seat portion (801) of the integral moldedelectrically insulating material adhering to the other surface of thecircuit plate is also visible in this view, and shown in more detail inFIG. 9.

FIG. 9 is a bottom plan view of the encapsulated circuit plate (700)illustrating yet another feature not incorporated in the circuit plateof FIG. 1. The seat (801) is a parametric ridge of electricallyinsulating material formed on the other surface of the conductivecircuit plate (700). As will be noted from a comparison of the views ofFIGS. 8 and 9, this parametric ridge (801) has interior dimensions thatare the same or slightly exceed the exterior dimensions of theinsulating material layer (701) on the upper surface. Thus, whenelectrically conductive plates (700) are stacked vertically, theparametric ridge (801) of one plate (700) closely surrounds theperimeter of the insulating material (701) on the mating conductiveplate in an interlocking manner, thus ensuring proper lateral alignmentof mating vertically stacked plates (700), while providing electricalinsulation and appropriate spacing between plates.

FIG. 10 is a side section view of three vertically stacked conductivecircuit plates (700). The interlocking aspect of the electricallyinsulating layers can also be appreciated from this view, as theparametric ridge (801) on the bottom surface of one circuit plate (700)surrounds and interlocks with the electrically insulating layer (701) ofthe conductive circuit plate (700) immediately below it. The edges ofthe parametric ridge (801) are chamfered slightly, as illustrated, toease alignment for stacking purposes. Also, if desired, the outerperimeter of the insulation (701) may be chamfered to permit easyinsertion into the ridge (801).

Conductive pins 401, whose construction has previously been described,are shown penetrating the stacked conductive layers (700) through theextrusions (703) in the contact pads. Electrical contact is enhanced byproviding the contact area greater than that of just an opening.

Yet another aspect of the invention is illustrated in FIG. 11, which isa top plan view of a side-by-side arrangement of stacked conductivecircuit plates configured as a power distribution module for use in avehicle. The adjacent, coplanar conductive circuit plates of sides A andB are arranged in mirror-image symmetry. The adjacent sides containingthe extended or connector electrical contacts (708) are oriented towardthe left and bottom edges on side A, while the fully extended contacts(708) appear on the right and bottom edges on side B.

Additional electrical contact extender portions (1101, 1102) are shownelectrically connected to selected ones of the truncated contacts (707)disposed along the top edge of sides A and B. These contact extenderportions (1001, 1002) may be fabricated from the same material as theconductive circuit plates themselves, that is, 0.08 mm CDA 110 half hardcopper, although other suitable conductive materials may also suffice.These electrical contact extender portions (1101, 1102) are attached tothe truncated contacts (707) both electrically and mechanically, throughbrazing, riveting, or soldering, for example, or a combination of these,in order to ensure both electrical contact and adequate structuralintegrity. The remaining truncated electrical contacts that are notselected for connection to electrical contact extender portions may betruncated even further, flush with the perimeter of the electricallyinsulating encapsulating layer, for example.

FIGS. 12-14 are top plan views of the top, middle, and bottom conductivelayers, respectively, of the stacked conductive layer configurationdescribed above with reference to FIG. 11. FIG. 13 depicts the middlelayer of the configuration, and shows that all of the electricalcontacts (707) depending from the conductive circuit plates (700) of themiddle layer are truncated. Of course, it is not necessary to truncateall of the electrical contacts on the conductive circuit plates of thecentral levels in a stacked configuration, but this truncation can makeit easier to configure the electrical contacts for alignment with amating electrical connector, and it helps to minimize the possibility ofa short between closely spaced contacts.

FIG. 13 also illustrates electrical interconnection between adjacent,coplanar conductive circuit plates (700) of sides A and B. Conductivejumpers (1301), which may be formed from the same material as theconductive circuit plates and electrical contact extender portions, aredisposed between selected facing truncated contacts (707) of adjacentconductive circuit plates (700). These conductive jumpers areelectrically and mechanically connected to the selected ones of thetruncated electrical contacts (707) by brazing, riveting, or soldering,or a combination of these, just as described above with reference to theelectrical contact extender portions of FIG. 11. Since the hazard of ashort circuit involving one of the unused truncated contacts is minimal,the unused contacts do not require further truncation, but may beshortened if desired.

FIG. 14 illustrates the interconnection of electrical contact extenderportions (1401, 1403) to selected ones of the truncated electricalcontacts (707) of the bottom level of the power distribution module. Aswill be noted in FIGS. 11 and 14, the electrical contact extenderportions can provide both interconnection between adjacent, coplanarcircuit plates and an off-module electrical connection capability (as in1101), a way of tying multiple connections from one circuit plate to anoff-module point (as in 1402), or a single extended connection to anoff-module contact point (1403).

FIG. 15 is a side elevational view of the power distribution moduledepicted in FIG. 11. Because the conductive jumpers (1301) joiningadjacent coplanar circuit plates are formed from the same relativelystiff material as the circuit plates themselves, the completed powerdistribution module forms a relatively rigid and robust structure. Ofcourse, the completed module would normally be disposed within a plastichousing (not shown) to provide weather resistance, additional structuralstrength, and means for supporting and securing electrical connectorhousings.

FIGS. 16 and 17 illustrate the use of vertically stacked conductivecircuit plates each having an appropriate spacer (701) and ridge (801)thereon in combination with a conventional printed circuit board. FIG.16 is a side sectional view of a plurality of conductive circuit plates(700) arranged in a stacked vertical configuration, much as describedwith reference to FIG. 10, above. In addition, FIG. 16 illustrates theinterconnection of electronic circuitry disposed on a printed circuitboard (1601) with the electrical circuitry of the stacked conductiveplate arrangement.

Electronic components (1602) are disposed on the printed circuit board(1601) in accordance with commonly accepted printed circuit board designguidelines. In a preferred form, the printed circuit board (1601) is asingle-sided board having plated-through holes to facilitate connectionwith conductive pins that penetrate both the printed circuit board andthe conductive plates that form the remaining layers. The use of asingle sided printed circuit board is not a disadvantage, however, sincenecessary crossover connections can be implemented on one of theconductive plate layers, if necessary. The ability to achieve a highcircuit density is one of the advantages of the inventive configuration.

FIG. 18 is a schematic diagram of the electronic circuitry disposed onthe printed circuit board of FIG. 17. As shown, even complicatedcircuitry such as microprocessor based control modules, may beimplemented through a combination of a printed circuit board and aplurality of conductive plates in a stacked arrangement.

FIG. 19 illustrates another embodiment of the present invention, whichis sometimes referred to as a splicing box (810). The splicing box ofFIG. 19 works according to the same principles of the embodimentsdescribed above.

FIGS. 20 and 21 are cross-sectional views of the splicing box of FIG.19. The splicing box (810) includes a nonconductive housing (811),preferably made from a thermoplastic polyester, which may be reinforcedwith 30% glass. However, one of skill in the art could identify othermaterials that may be used, instead. The housing (811) is preferablymade from two halves (812, 814). The two halves of the housing may besecured by screws (816), or any other suitable means.

The housing (811) may include one or more openings or receptacles (818)for receiving connector assemblies (not shown). The receptacles (818)may be provided with a latch, or some kind of detente mechanism toreleasably retain the connector within the receptacles (818). Inaddition, smaller openings or receptacles (820) may also be provided inthe housing for receiving fuses or smaller electrical components.

In the particular embodiment illustrated in FIGS. 19-25, the receptacles(818) on one housing side (812) are in alignment with the receptacles(818) on the other housing side (814). However, it is not necessary forthe receptacles (818) to be in alignment with each other. In fact, it ispossible to have receptacles on only one side of the housing (811). Theparticular arrangement of connector receptacles depends on theapplication of the splicing box (810).

Turning attention now to FIGS. 22 and 23, inside the housing are locateda conductive plate (822) and an insulative plate (824). The conductiveplate (822) includes a plurality of contact pads (825), which arepreferably arranged in a rectangular grid pattern. However, the contactpads (825) may be arranged in any other design suitable for its intendedpurpose.

The contact pads (825) are separated from each other by cut-outs (826),such as cross-shaped cutouts. The arrangement of the cut-outs (826)leaves a plurality of connecting surfaces (828) joining adjacent contactpads (825). Electrical connection between adjacent contact pads (825)can be prevented by severing the connecting surfaces (828) between thetwo contact pads (825). In addition, an opening (830) is provided ineach contact pad (825). In a preferred embodiment, the spacing betweeneach column of contact pads (825) is uniform, with the exception of thelast two columns. The spacing between the columns of contact pads isarranged to correspond to standard spacing between contacts in aconnector assembly. In one embodiment, the columns of contact pads (825)are spaced at 6.9 mm, and the rows are spaced at 6.75 mm. However, anysuitable spacing may be used.

The spacing between the last two columns is slightly larger than thespacing between the remaining columns in order to accommodate contactsfrom a fuse or other electrical components. In a preferred embodiment,the spacing between the last two columns (832, 834) is set at 8.1 mm toaccommodate a standard automotive fuse, such as an ATM-style minifusemanufactured by the Bussmann Division of Cooper Industries, Inc.However, other spacings may be used. Other devices that may be used inthe receptacles (820) include mini-circuit breakers, ATC circuitbreakers, relays, flashers and diodes.

In a preferred embodiment, the smaller receptacles (820) in the housing(811) are designed to line up with the last two columns (832, 834) ofthe conductive plate (822). When the conductive plate (822) is in placewithin the housing (811), one opening (830) from column (832) and oneopening (830) from column (834) are aligned with one of the receptacles(820) so as to accommodate the contacts from a device inserted into thereceptacle (820). Another opening (830) from column (832) and anotheropening (830) from column (834) are aligned with the other of thereceptacles (820).

The spacing of the columns of contact pads (825) is not critical to thepresent invention. The arrangement of the contact pads (825) may includeany number of rows and columns, with either regular or irregularspacing. In fact, it is not necessary that the contact pads (825) bearranged in rows and columns, provided that they are connected byconnecting surfaces that can be easily severed.

Turning attention now to FIG. 23, a nonconductive, insulative sheet orplate (824) is preferably, although not necessarily, provided with thesame outer dimensions as the conductive plate (822). The nonconductiveplate (824) includes a plurality of openings (836). Each of the openings(836) in the nonconductive plate (824) is aligned with a correspondingopening (830) in the conductive plate (822) when the conductive plate(822) and the nonconductive plate (824) are placed together, as shown inFIGS. 24 and 25. In addition to the openings (836), there are recessedareas (838) on each side of each opening (836) on one side of the plate(824). The specific arrangement of the recesses (838) and openings (836)can be better appreciated from FIG. 25. The specific shape of theopenings (836) and recesses (838) in the nonconductive plate (824) areintended to facilitate retaining pins (840) in place within theconductive plate (822).

The pins (840) are made from a conductive material and are preferably ofa size which fits tightly within the openings (830). The pins (840) maybe tin or solder plated for corrosion protection.

In addition, each pin (840) may include a hilt (842). The hilt (842) islarger than the openings (830) in the conductive plate (822), and thusprevents the pin (840) from passing all the way through the openings(830) in the conductive plate (822). The size and shape of the hilt(842) of each pin (840) correspond to the recesses (838) associated withthe openings (836) in the nonconductive plate (824). Accordingly, whenpins (840) are inserted through the openings (830) in the conductiveplate (822), and the nonconductive plate (824) is arranged adjacent theconductive plate (822), as illustrated in FIGS. 24 and 25, the pins(840), by means of the hilts (842), are trapped between the conductiveplate (822) and the nonconductive plate (824).

Alternatively, the conductive plate (822), instead of the nonconductiveplate (824), may include recesses for trapping the hilts (842) of thepins (840).

The pins (840) illustrated in this preferred embodiment have across-sectional shape that is substantially rectangular. However, thepins may be cylindrical, or any other shape. As best seen in FIGS. 20and 21, the assembly of the nonconductive plate (824), the conductiveplate (822), and pins (840) fit between the two housing halves (812,814). It is not necessary or intended to provide pins (840) extendingthrough every one of the openings (830) in the conductive plate (822).Instead, pins (840) are only inserted through the particular openings(830) that are intended to be in alignment with the receptacles (818),and which are necessary to form a connection with a connector (notshown) that may be plugged into the receptacles (818). The receptacles(818) may be provided with a latch, or some kind of detente mechanism toreleasably retain the connector within the receptacles (818).

As an alternative, pins could be arranged that do not protrude from bothsides of the conductive plate (822), but instead protrude from only oneside of the plate (822). One embodiment could use some pins thatprotrude from both sides of the plate (822) and some pins that protrudefrom only one side of the plate (822). Pins that protrude from only oneside of the plate may be secured by laser welding, or any other suitableattachment mechanism.

By selectively severing the connecting surfaces (828) between certaincontacts pads (825), a wiring circuit may be constructed, wherein acircuit may be completed between two or more pins, as desired. Forexample, in the example shown in FIG. 26, several connecting surfaces(828) have been removed thus isolating contact pads (802 a, 802 b, 802c, and 802 d). In addition, the contact pads between contact pads (802c) and (802 d) and the contact pads between contact pad (802 a) andcontact pad (802 c) are also connected. These contact pads (802 a)through (802 d) form a circuit that is isolated from the remainder ofthe conducting plate (822). Thus, pins extending through the openings(830) in contact pads (802 a, 802 b, 802 c, and 802 d) can be used tomake connection with connecting blocks plugged into the receptacles(818).

In an actual example, there would likely be several independent circuitsformed on one plate (822).

In the embodiments illustrated in FIGS. 19 through 26, the nonconductingplate (824) lies adjacent to the conducting layer (822), and is held inplace within the housing (811) by the housing halves (812, 814). It isnot necessary for the nonconducting plate (824) to be coated onto theconductive plate (824), or to otherwise use an adhesive to adhere thetwo plates (822, 824) together. Pressure from the two housing halves(812, 814) is sufficient to retain the two plates (822, 824) together.Nevertheless, one of ordinary skill in the art would appreciate that thenonconductive plate (824) could be adhered to the conductive plate (822)with an adhesive.

Alternatively, instead of using a distinct nonconductive plate (824), alayer of nonconductive material could be coated or insert molded ontothe conductive plate (824), in a manner similar to the previouslydisclosed embodiments. In such an embodiment, the pins (840) may also besecured by friction, laser welding, or some other manner readilyavailable to those of skill in the art.

Preferably, the conductive plate (822) in the FIG. 19 embodiment is ametal sheet having a thickness of about 0.5 to 1.3 mm. Other conductivematerials of different thicknesses could be used, depending upon theintended use of the device. For vehicle uses, the preferred metal iscopper. However, brass or stainless steel may also be used. In oneembodiment, the conductive plate (822) may be stamped from a 0.08 mm CDA110 half-hard copper. The thickness of the plate may be determined bythe current requirements, wherein higher currents would require thickerplates. Currents of up to 30 amps can be used with the 0.08 mm copperplate. From a practical point of view, the actual limitations oncurrents are likely determined by the connectors used with the splicingbox, rather than the thickness of the plate. Voltages of up to 50 VoltsDC may be easily accommodated.

In general, the splicing box (810) and the power distribution boxesdisclosed in this disclosure may be used to power almost any and all ofthe electrical devices in a vehicle, with the exception of the sparkplug power. The power for the headlights, air conditioning, radios, etc.may all be distributed through either the splicing box, the powerdistribution box, or a combination of both.

To facilitate subsequent soldering operations, the plate (822) may besolder plated or coated to provide a solder layer thickness of about0.005 to about 0.010 mm. The conductive material may be preplated orcoated before the stamping operation, or a plating or coating may beadded later. One of the preferred solder compositions for a copper baseis a tin solder composition. Of course, other suitable compositions,known to those skilled in the art, may be substituted for the solderjust described.

The nonconductive plate (824) may be made from any suitablenonconductive material. In a preferred embodiment, the nonconductiveplate (824) is made from Rynite FR530, 94v-0, manufactured by E.I.Dupont Company. This material is described as a PET (polyethyleneterephthalates) thermoplastic material. However, any number ofinsulating plastic or other materials would serve in this application.

According to another feature of the present invention, the terminalspring (501), illustrated in FIGS. 5a through 5 c, and described above,may be used in combination with the pins (840) of the FIG. 19embodiment.

When programming the conductive plate (822), i.e., stamping out theundesired connecting surfaces (828) from the conductive plate (822), itwill become apparent that one or more groups of contact pads (825) maybe completely isolated from the remainder of the conductive plate (822).See for example contact pads (802 a, 802 b, 802 c, and 802 d) in FIG.26. In order to retain the “island” of contact pads in its respectiveplace within the conductive plate (822), a layer of thin, nonconductivetape may be adhered to one surface of the conductive plate (822). Thus,as the connecting surfaces (828) are severed from the conductive plate(822), any islands of contact pads will retain their proper relativeposition because of the tape. If the nonconductive plate (824) issecured to the conductive plate (822) with an adhesive, the use of thetape to retain the islands of contact pads will not be necessary.

After the pins have been inserted and locked between the conductiveplate (822) and nonconductive plate (824), the plates and pins (840) maybe secured by heating the assembly in order to reflow the solder coatingon the conductive plate (822). The reflowing of the solder enhances theelectrical connection between the plate (822) and the pins (840), andhelps to secure the pins (840) within the plate (822). As an alternativeto using reflowed solder, a laser welding process may be used to securethe pins (840) to the plate (822). In such a case, there is no need tocoat the plate (822) with solder.

Although the FIG. 19 embodiment discloses only one conductive plate(822) and one nonconductive plate (824), any combination of conductiveand nonconductive plates may be used, provided that the conductiveplates are separated by nonconductive plates or layers. For example, adevice may include one conductive layer surrounded by two nonconductivelayers. Alternatively, it is possible that a single conductive plate maybe used without a nonconductive plate or layer. However, in such a case,it may be necessary to use a layer of taper or adhesive on theconductive plate (822) to retain any islands of pads in their properplace.

In an embodiment using more than one conductive plate (822), it may benecessary to enlarge some of the openings (830) so that some of the pins(840) extending through some of the holes (830) do not make contact withthe conductive pad (825) surrounding the opening (830). This principleis much the same as that set forth above with respect to opening (703a), illustrated in FIG. 10, and described above.

With respect to the embodiments disclosed in FIGS. 1-18, instead ofcoating a layer of nonconductive material onto the conductive plates, asdescribed above with respect to those embodiments, as an alternative, adiscreet, separate, nonconductive plate may be arranged between theconductive plates, similar to the manner disclosed in the FIG. 19embodiment. It is not necessary for the nonconductive plates to beadhered to or coated onto the conductive plates in order to form thecompleted assembly.

The inventors have described herein an electric power distributionapparatus and a splicing box that are inexpensive to produce, easilyadapted for specific model applications, and durably packaged. Althoughseveral of the inventive features are described with particularity inthe appended claims, it should be understood that there may bevariations of the inventive concept that, while not explicitly claimed,nonetheless fall within the spirit and scope of the invention.

What is claimed is:
 1. A power distribution apparatus comprising: aconductive plate, said plate including an array of contact pads; each ofthe contact pads including means for receiving a connector pin; aplurality of removable connector links interconnecting the contact pads,wherein discrete circuits can be formed on said conductive plate byselectively removing a portion of said removable connector links; anonconductive layer adjacent said conductive plate, said conductiveplate and said nonconductive plate having matching openings; a pluralityof pins extending through a portion of said openings to form electriccontacts; and said nonconductive layer includes recesses adjacent saidopenings on a side of said nonconductive layer facing said conductiveplate for entrapping a hilt on each of said pins.
 2. The powerdistribution apparatus of claim 1, further comprising a housing forretaining said nonconductive layer and said conductive plate, saidhousing including receptacles for connector assemblies that engage withsaid electric contacts.
 3. A method of assembling a power distributionapparatus, comprising the steps of: providing a conductive plate, saidconductive plate including a plurality of contact pads that areinterconnected by removable connecting links; providing a nonconductivelayer adjacent said conductive plate; selectively removing a portion ofsaid connecting links to form discrete circuits on said conductiveplate; mounting contact pins to selected contact pads; and securing aportion of each of said contact pins between said conductive plate andsaid nonconductive layer.
 4. The method of claim 3, further comprisingmounting said conductive plate in a nonconductive housing that isadapted to receive connector assemblies that are aligned with saidcontact pins.
 5. A power distribution apparatus comprising: a conductiveplate, said plate comprising an array of contact pads and a plurality ofremovable connector links interconnecting said contact pads, each ofsaid contact pads comprising an opening therethrough for receiving aconnector pin; wherein discrete circuits can be formed on saidconductive plate by selectively removing a portion of said removableconnector links; a nonconductive plate adjacent said conductive plateand having a plurality of openings therethrough, said openings of saidnonconductive plate aligned with said openings of said conductive plate,one of said conductive layer and said nonconductive layer comprising atleast one recess adjacent at least one opening and facing the other ofsaid conductive layer and nonconductive layer; and a plurality of pinsextending through a portion of said openings to form electric contacts,at least one pin including a portion larger than said openings andreceived in said at least one recess, thereby securing said pin betweensaid conductive plate and nonconductive plate.
 6. A power distributionapparatus in accordance with claim 5 wherein said portion of said pincomprises a hilt.
 7. A power distribution apparatus in accordance withclaim 5 further comprising a housing enclosing said conductive plate andsaid nonconductive plate; said housing comprising at least one connectorreceptacle aligned with said pins.
 8. A power distribution apparatus inaccordance with claim 7 said housing further comprising a first side, asecond side, and a plurality of connector receptacles, at least oneconnector receptacle located on each of said first and second sides. 9.A power distribution apparatus comprising: a housing comprising a firstside, a second side, and at least one connector receptacle extendingfrom said first side and said second side; a conductive plate withinsaid housing, said conductive plate including a plurality of contactpads that are interconnected by removable connecting links, each of saidcontact pads including openings for receiving a connector pin, wherein aportion of said connecting links are removable to create a circuit onsaid conductive plate; and a nonconductive plate adjacent saidconductive plate within said housing; and a plurality of connector pinsselectively mounted to a portion of said openings through saidconductive plate, at least one of said connector pins comprising a hilt.10. A power distribution apparatus in accordance with claim 9, whereinsaid hilt is received in a recess in one of said conductive plate andsaid nonconductive plate and securing said hilt therebetween.
 11. Apower distribution apparatus in accordance with claim 9 wherein saidconnector receptacles are aligned with said pins.
 12. A powerdistribution apparatus in accordance with claim 9 wherein said pins aresubstantially rectangular.